Zortrax M200 Plus 3D Skrinter

Zortrax M200 Plus 3D Skrinter

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PRODUCT DESCRIPTION

A high-performance desktop 3D printer with Wi-Fi connectivity.

An advanced desktop 3D printer for low-volume production and large scale additive manufacturing. Based on the globally acclaimed Zortrax M200 printer, this model retains its high performance, remarkable accuracy and consistency, while adding wireless connectivity using Z-SUITE slicing software. It’s also equipped with a built-in camera to manage the printing progress and a user-friendly touchscreen interface and at the same time adds wireless connectivity that helps monitor the printer via Z-SUITE slicing software. Side Covers are included.

Dedicated filaments: Z-ABS, Z-ABS 2, Z-ASA Pro, Z-ESD v2, Z-FLEX, Z-GLASS, Z-HIPS, Z-NYLON, Z-PCABS, Z-PETG, Z-PLA, Z-PLA Pro, Z-ULTRAT

Lead time: 30 days

Device features:

  • 3D printing farms ready
  • Wi-Fi, Ethernet and USB connection
  • Built-in camera
  • User-friendly design of the touchscreen
  • Material End Detection
  • Upgraded extruder (compatible with advanced and semi-flexible filaments)
  • Upgraded cooling system (double fan and extruder cooling)
  • Upgraded hotend (V3) and nozzle with new geometry
  • Perforated plate with pogopins instead of small connector
  • Wide range of dedicated filaments
  • External materials are applicable
  • Optical endstops for the X and Y axes (previously mechanical)
  • A buzzer (improves device’s workflow and reminds users about an important action they need to take)
  • Blackout Response System

Product Specifications

Device Features
BUILD VOLUME200 x 200 x 180mm (7.9 x 7.9 x 7.1 in)
MATERIAL CONTAINERSpool
MATERIAL DIAMETER1.75 mm (0.069 in)
CONNECTIVITYUSB, RJ45, WiFi
EXTRUDERSingle (upgraded for experimental materials)
NEW COOLING SYSTEMDouble fan and extruder cooling
HOTENDV3 and nozzle with new geometry
MATERIAL RUNOUTMechanical endstop
BUILD PLATEPerforated plate with pogopins instead of small connector
SUPPORTMechanicaly removed
MATERIALSM Series dedicated materials (recommended) + new Z-SEMIFLEX
EXTERNAL MATERIALSYes
PLATFORM LEVELLINGAuto
TOUCHSCREEN4″ IPS 800×480
Printing
PRINT TECHNOLOGYLPD (Layer Plastic Deposition) / FFF
LAYER RESOLUTION90-390 microns
MINIMAL WALL THICKNESS400 microns
DIMENSIONAL ACCURACY+/- 0,2%*
ANGLE ACCURACY+/- 0,2%**
MAXIMUM PRINTING TEMPERATURE (EXTRUDER)290° C (554° F)
BUILD PLATFORMHeated
PROCESSORQuad Core
OPERATION SYSTEMAndroid
MAXIMUM PLATFORM TEMPERATURE105° C (221° F)
AMBIENT OPERATION TEMPERATURE20° – 30° C (68°-86° F)
STORAGE TEMPERATURE0° – 35° C (32°-95° F)
AC INPUT110 V ~ 5.9 A 50/60 Hz
240 V ~ 2.5 A 50/60 Hz
MAXIMUM POWER CONSUMPTION320
Software
SOFTWARE BUNDLEZ-SUITE 2.0
SUPPORTED FILE TYPES.stl, .obj, .dxf, .3mf
SUPPORTED OPERATING SYSTEMSMac OS X / Windows 7 and newer versions
OUTPUT FORMATZCODEX